High-Temperature Chemical Vapor Deposition (HTCVD)

The HTCVD process allows you to produce Silicon-Carbide crystals used for producing, for example Schottky diodes with minimal switching losses and blue LEDs. Silicon Carbide is also used for electronic components designed to withstand high temperatures or strong doses of ionizing radiation. Due to its high thermal conductivity, Silicon Carbide is also used as a substrate for other semiconductor materials.

The Process

A solid component is deposited on the hot surface of a substrate following a chemical reaction from the gas phase. For this to happen, gaseous compounds of the layer components must be present that lead to the growth of a solid layer at a specific reaction temperature. The HTCVD method for chemical gas phases involves at least one chemical reaction on the surface of the substrate to be coated. To ensure that the surface reaction is prioritized over competing reactions in the gas phase and, in turn, to prevent the formation of solid particles, chemical gas phase deposition processes usually take place at reduced pressure.

Applications

Our HTCVD-series systems are specially designed for producing this high-purity Silicon Carbide for the semiconductor, power electronic, and optoelectronics industries.

Immediate Contact

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PVA TePla Singapore Pte. Ltd.
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Singapore, 536202

Telephone: +65 9631 4005