The plasma systems for single-wafer operation are combined in the GIGAfab product range. These systems are available in various configurations depending on the type of substrate or the customer’s application requirement—from the manually loaded system to the fully automatic version.
Depending on the application, these systems can be equipped with various types of plasma sources: from simple and cost-effective microwave sources and large-scale sources to radical sources with a remote plasma for temperature-sensitive silicon etching processes for thinned wafers. The wafer can be tempered with various concepts here.
In the manually loaded systems, the chamber has a pull-out door, and the wafers lie on the heating or cooling plant mounted on the door. In the automatic systems, the wafers are loaded into the chamber with a robot system by means of on-the-fly alignment.
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