Plasma ashing, sometimes referred to a stripping removes photo resist from wafers. Descum processes are similar but are used to remove residual photo resist in trenches.
Plasma is used widely throughout the world for a broad variety of industrial applications covering industries such as automotive, aerospace, batteries, electrical, food packaging, electronics, fuel cells, glass, optics, plastics, packaging, shipbuilding, space, and textiles. New applications are being developed daily and the field continues to grow at an enormous rate because it offers an environmentally friendly and cost-effective alternative to wet chemistries.
Wettability of hydrophobic materials by using a plasma process will help liquid material spread over the treated surface easily. The plasma process will take a hydrophobic material to hydrophilic state in a matter of minutes by removing contaminants and by applying the right chemical preparation to make the material more hydrophilic.
Materials that need to have non- stick properties is possible by using a low pressure plasma process. PVA TePla non- stick coatings have low coefficient of friction properties, wear resistance, and water resistant properties.
A clean surface is the most important step you can do for making a quality bond, in addition to using a quality adhesive. The importance of having a clean surface allows for the adhesives to adhere to the surfaces. Most surfaces are usually covered with dirt, grease, dust, oil, oxide films, and most newly manufactured plastics have mold release agents on them too.
Plasma is used widely in the electronics industry for a wide variety of applications ranging from adhesion promotion of encapsulants and adhesives, to enhancing the release properties of optical disc master stampers. The power of plasma to precision etch and clean activate surfaces prior to metallization and solid state bonding has been recognized by industries such asthe defense, aerospace, automotive, space and energy industries.
Vacuum deposition of coatings at PVA TePla is utilized by a Plasma Enhanced Chemical Vapor Deposition (PECVD) process. This process is one of many types of deposition coating processes. This type, PECVD, is the most environmentally friendly process. The process uses a dry chemical reaction in a plasma reactor to enhance the chemical reaction rates of the precursors. Lower processing temperature is an advantage of PECVD. It also allows for deposition of organic coatings at the lower temperatures.
PVA TePla offers R&D and contract processing services with a wide range of applications. Many customers utilize these services for clinical trials and small to medium production.
Gas plasma technology is commonly used to precision clean and activate, decontaminate surfaces, promote adhesion of functional bio-molecules and in conjunction with specific chemical vapors sterilize of in-vivo and in-vitro medical devices.
Plasma treated PCBs increases the surface energy of advanced materials, including fluoropolymer, providing excellent lamination, wettability and metalization through-holes without the use of wet chemicals.
The growth of thin films via chemical vapor deposition (CVD) is a powerful technique for bioassay, microarray, medical and microelectronic device (MEMS) fabrication. Chemical vapor deposition (CVD) is carried out by passing a volatilized precursor (such as a silane, organometallic or metal coordination complex) over a heated substrate. Thermal decomposition of the precursor produces a thin-film deposit, the ligands associated with the precursor are cleanly lost to the gas exhausted.